Huaswin Electronics Co.,Limited
Huaswin Electronics Co.,Limited Rigid PCB, Flexible PCB, Rigid Flex PCB, PCB Assembly, SMT / Through hole Assembly, custom cable assembly manufacturer in China
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Double Sided PCB Board Assembly / High TG PCB 2 Layer 4 Layer
Quick Detail:
Detailed Specification of PCB Manufacturing
| 1 | layer | 1-30 layer |
| 2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
| 3 | Board thickness | 0.2mm-6mm |
| 4 | Max.finished board size | 800*508mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | min.line width | 0.075mm(3mil) |
| 7 | min.line spacing | 0.075mm(3mil) |
| 8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 |
| 15 | Profiling punching | Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
| 1 | Type of Assembly | SMT and Thru-hole |
| 2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| 3 | Components | Passives Down to 0201 Size |
| BGA and VFBGA | ||
| Leadless Chip Carries/CSP | ||
| Double-Sided SMT Assembly | ||
| Fine Pitch to 08 Mils | ||
| BGA Repair and Reball | ||
| Part Removal and Replacement-Same Day Service | ||
| 3 | Bare Board Size | Smallest:0.25x0.25 Inches |
| Largest:20x20 Inches | ||
| 4 | File Formats | Bill of Materials |
| Gerber Files | ||
| Pick-N-Place File(XYRS) | ||
| 5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment |
| 6 | Component Packaging | Cut Tape |
| Tube | ||
| Reels | ||
| Loose Parts | ||
| 7 | Turn Time | 15 to 20 days |
| 8 | Testing | AOI inspection |
| X-Ray inspection | ||
| In-Circuit testing | ||
| Functional test |
Factory veiw:
