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Aluminium PCB LED Light Assembly Board Immersion Gold Solder Mask With Lead free HASL Finishing
PCB Assembly includes the manufacturing process of Surface Mount Technology(SMT), Manual Insertion (MI), Auto-insertion (AI) and Chip on Board(COB).
※ Surface Mount Technology
※ Pin Through-hole Assembly
※ RoHS
※ Selective Wave Soldering
※ Conformal Coating
※ Complete box build
※ Inspection Methods
Surface Mount Technology
Employing state of the art DEK printers, Placement machines and BTU convection air reflow ovens. With many years experience of placing BGA, UBGA, CSP and small profile passives down to and including 0201, the plant offers a cost effective high yield solution to any SMT requirement.
Pin Through Hole
Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 25" x 25". Placement rates reach 5000 pieces per hour with an accuracy of 99% minimizing component loss.
RoHS Regulations
Full lead based processing for exempt category product, whilst also having invested in lead-free equipment and process control.
Selective Wave Solder
Having the Selective Wave soldering machines, with consistent quality and process control when assembling boards having multiple ground and power planes, high-current connectors or A-typical distribution of components.
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non conductive dielectric layer that is applied onto the printed circuit board assembly to protect the electronic assembly from damage due to contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, plastics, casings and print & packaging material
Specifications
1. Professional Surface-mounting and Through-hole soldering Technology
2. Various sizes like precision0402, 0603, 0805, 1210 and 2512 components SMT technology
3.ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4.PCB Assembly With CE,FCC,Rohs Approval
5.Nitrogen gas reflow soldering technology for SMT.
6.High Standard SMT&Solder Assembly Line
7.High density interconnected board placement technology capacity.
Quote requirement:
1.Gerber files of the bare PC board
2.BOM file (Components List): manufacturer’s part number, type of part, packaging type, component
locations and quantity
3.Dimensional specification for non-standard components
4.Assembly drawing
5.Final test procedures (if applicable)
6.in order to shorten the lead time, please advise us alternative parts (same specifications but
different brand name)
7.Estimated order quantity
8.If possible, please send prototype/sample board/photo to us for further reference
We also offer:
1.Contract Manufacturing
2.Engineering Services
3.PCB Design & Assembly
4.Product Design
5.Prototyping
Items | Paramerers |
Layer count | 1-30 layers |
Material | FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui |
Maxpanel size | 32”±20”(800mm±508mm) |
Min width/space(min) | 3mil/3mil |
Max copper weight | 140um(4oz) for inner layer, 175um(5oz) for outer layer |
Min machine drill size | 0.2mm(8mil) |
Via hole tpye | Blind/Burried/plugged |
Thickness of finished board | 0.20-6.0mm |
Tolerance | Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm |
Color of solder mask | Green, Black, Blue,Red, White and so on |
Surface freatment | HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Tin, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u”),Gold figers ,Carbon print, Peelabe Mask |
Hardness of solder solder | >=6H |
Outline finished | CNC, V-CUT, Punching |
Peel strength of line | ≥61B/in |
Warp and twist | ≤0.7% |
Applications of our products:
1.Computers and relevant products: Movable power board, U Disk, network interface, panel
computer, cameral, wire-less mouse.
2.Home appliance: smart projector/digital cameral, high-frequency board. Recorder and repeater
board, auto audio equipment main board and control board.
3.Wire-less communication: mobile board,. GPS/ direction record board, wireless telephone main
board, intercom main board.
4.LED Lighting: LED drive power, LED light panel, LED light belt.
5.We have been specializing in the production of control units for commercial equipment such as
industrial measuring and testing equipment, monitory and inspection systems, computers, home
appliance such as air conditioners,refrigerators, solar-power systems, water-heat and automotives.